Lunch@ Events – Trade Show Press and Innovator Events

ZAP is a pioneering electric car company in Santa Rosa, California.  You may have seen the company’s unusual Xebra cars or heard about their flashy ZAP Alias.  The company recently announced it is entering the fleet car business through a partnership with Jonway in China, who will manufacture all electric cars based on a very attractive EU-quality sedan design.   ZAP is also getting into the charging station business and has targeted countries around the world where the path to adoption of electric cars is being eagerly awaited.

ZAP’s  highly attractive three-wheeled vehicle, the Alias, will compete in the Progressive Insurance Automotive X Prize.  Check out this video with Joseph Rajakaruna, engineer for ZAP.  Joseph combines his interest in science and art with his passion for cars and a rich background at Honda and Visteon Automotive, a division of Ford.  Now he is part of the ZAP electric vehicle team.   

We had the opportunity to see the Alias and the ZAP taxi in person this past weekend, and even myself at six feet tall could slip easily into the car.  We’ll keep you updated about the X-Prize competition.

Have you missed capturing an important moment because  the flash on your digital camera didn’t cycle fast enough?  Maybe it was the rechargeable batteries and not the camera itself.  PowerGenix showed us a new generation of rechargeable battery that even made the lighting kit on our video camera for this interview last longer and shine  brighter.  And it’s not just for cameras, it’s for all kinds of products that use batteries – even the ones that say don’t use rechargeables.  Watch this interview with Dan Squiller of PowerGenix at Lunch at Piero’s media and innovator event during CES 2010 and go out and buy yourself some new, green rechargeable batteries.

VIA Nano Platform Proves Small is Beautiful at CES

Optimizing the power and efficiency of the VIA Nano platform, VIA takes a ‘no compromise’ entertainment experience to Las Vegas in 2010

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its participation at the annual Lunch@Piero’s press event, to be held during CES in Las Vegas on January 7th and 8th. Attendees will be able to gain first hand experience of a host of new technologies and PC designs that usher in a decade where HD entertainment meets ruthlessly compact design and true mobility.

Recently announced VIA Nano 3000 Series processors will be shown in tandem with the latest digital media chipset, the VIA VN1000 – a pairing that combines industry leading DirectX 10.1 graphics performance and a fully programmable HD and Blu-ray capable video engine with the fastest and most power-efficient VIA Nano processor ever.

 “VIA is quickly beating a path towards the digitally sophisticated and visually enhanced future that lies ahead,” said Richard Brown, Vice President of International Marketing, VIA Technologies, Inc. “Visitors to Piero’s will appreciate how the latest VIA Nano processor platforms are enabling new standards in visually stunning entertainment.”

Attendees at the Lunch@Piero’s event will be able to witness an incredibly compact Pico-ITX form factor board re-writing the rule book on HD video playback, with the incredibly compact Pico-ITX-based VIA AMOS-3001 fanless embedded PC offering the embedded industry the very latest multimedia and digital video technologies.

 VIA will showcase high profile products from Samsung and Lenovo illustrating continued momentum in the top tier thin and light netbook market, along with the latest version of the famous OLPC laptop, now based on the power-efficient VIA C7 processor. VIA subsidiary company, VIA Labs, will also demo first-to-market SuperSpeed USB 3.0 controller technologies with blisteringly fast transfer rates of up to 5Gbps.

More information on the Lunch@Piero’s event can be found on the VIA website at:

http://www.via.com.tw/en/company/events/ces2010/index.jsp

VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw